Chip-type solid electrolytic capacitor

The invention relates to a chip-type solid elelctrolytic capacitor which uses a capacitor element having an anode lead protruding from one end face of an anode body of a valve metal. The capacitor element is covered by an insulating resin cover layer except a cathode end face and the protruding part of the anode lead. A cathode terminal is formed on the cathode end face and the resin cover layer in an area near the cathode end face, and an anode terminal is formed on the resin cover layer so as to make contact with the protruding anode lead. The anode terminal is made up of a conductive layer which is formed on the resin cover layer only in a limited area so as not to make contact with the anode lead and has a microscopically rough surface, a plating layer which is formed on the conductive layer and the resin cover layer in the area over the aforementioned end face of the anode body and covers the protruding anode lead and a solder layer formed on the plating layer. In the anode terminal the rough surface of the conductive layer enhances the adhesion of the overlaid plating layer, and the separation of the conductive layer from the anode lead eliminates the problem about different thermal expansion coefficients of the conductive layer and the anode lead. Therefore, when the chip-type capacitor is mounted on a printed circuit board the bonding strength is enhanced.