Photo resist film application mechanism
A dry film photoresist laminator includes a punch and die assembly 24 which punches a rolled sheet dry film photoresist material 14, that is comprised of a dry film photoresist material 18 sandwiched between a Mylar top layer 16 and a polyolefin bottom layer 20, into photoresist decals. The photores...
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| creator | NAHATA PRAKASH BRADY WILLIAM A CHAN SEE A FREISITZER NORBERT TAVARES MARIO G. M MEINERT ROLF G PERLINI JULIUS J WEST DOUGLAS A |
| description | A dry film photoresist laminator includes a punch and die assembly 24 which punches a rolled sheet dry film photoresist material 14, that is comprised of a dry film photoresist material 18 sandwiched between a Mylar top layer 16 and a polyolefin bottom layer 20, into photoresist decals. The photoresist decals are bonded to a tacky transport tape 40 which carries the decals to a polyolefin peeler assembly 54 that rolls a high tack tape 57 along the polyolefin layer 20 of the decal, thereby peeling it from the decal. The decal is advanced by a laminating assembly 44 which rolls the decal onto a heated wafer 72, thereby bonding the exposed photoresist material 18 to the wafer 72. Bonded wafer 72 and decal 14 are removed from the transport tape 40. A tape transport assembly 44 carrying the transport tape and decal is advanced through the various process steps. |
| format | Patent |
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M ; MEINERT; ROLF G ; PERLINI; JULIUS J ; WEST; DOUGLAS A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5328546A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1994</creationdate><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>NAHATA; PRAKASH</creatorcontrib><creatorcontrib>BRADY; WILLIAM A</creatorcontrib><creatorcontrib>CHAN; SEE A</creatorcontrib><creatorcontrib>FREISITZER; NORBERT</creatorcontrib><creatorcontrib>TAVARES; MARIO G. M</creatorcontrib><creatorcontrib>MEINERT; ROLF G</creatorcontrib><creatorcontrib>PERLINI; JULIUS J</creatorcontrib><creatorcontrib>WEST; DOUGLAS A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAHATA; PRAKASH</au><au>BRADY; WILLIAM A</au><au>CHAN; SEE A</au><au>FREISITZER; NORBERT</au><au>TAVARES; MARIO G. M</au><au>MEINERT; ROLF G</au><au>PERLINI; JULIUS J</au><au>WEST; DOUGLAS A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photo resist film application mechanism</title><date>1994-07-12</date><risdate>1994</risdate><abstract>A dry film photoresist laminator includes a punch and die assembly 24 which punches a rolled sheet dry film photoresist material 14, that is comprised of a dry film photoresist material 18 sandwiched between a Mylar top layer 16 and a polyolefin bottom layer 20, into photoresist decals. The photoresist decals are bonded to a tacky transport tape 40 which carries the decals to a polyolefin peeler assembly 54 that rolls a high tack tape 57 along the polyolefin layer 20 of the decal, thereby peeling it from the decal. The decal is advanced by a laminating assembly 44 which rolls the decal onto a heated wafer 72, thereby bonding the exposed photoresist material 18 to the wafer 72. Bonded wafer 72 and decal 14 are removed from the transport tape 40. A tape transport assembly 44 carrying the transport tape and decal is advanced through the various process steps.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| subjects | LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING |
| title | Photo resist film application mechanism |
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