Non-silicon and silicon bonded structure and method of manufacture

A non-silicon substrate is bonded to a silicon substrate with a stress-relief layer between the non-silicon substrate and the silicon substrate. The stress-relief layer reduces the stress between the non-silicon substrate and the silicon substrate. The stress is created by the difference in the ther...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CAMBOU, BERTRAND F, LIAW, H. MING, TOMOZANE, MAMORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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