Semiconductor device
A semiconductor device including a lead frame provided with a die pad and a plurality of leads arranged around the die pad, a semiconductor element mounted on the die pad, and a molding resin for sealing the semiconductor element. A spacing defined between the die pad and the leads is sized, i.e. ma...
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| creator | FUKASAWA HIROYUKI MAKINO HARUHIKO |
| description | A semiconductor device including a lead frame provided with a die pad and a plurality of leads arranged around the die pad, a semiconductor element mounted on the die pad, and a molding resin for sealing the semiconductor element. A spacing defined between the die pad and the leads is sized, i.e. made very small, that a flow velocity of a first portion of the molding resin flowing in a peripheral region of the semiconductor element becomes substantially equal to a flow velocity of a second portion of the molding resin flowing on at least an upper surface of the semiconductor element. That is, the first portion of the molding resin flowing in the peripheral region of the semiconductor element receives resistance due to the very small spacing between the die pad and the leads. Accordingly, the flow of the molding resin as a whole can be made uniform to thereby reduce or eliminate the generation of voids in the molding resin. As a result, reliability and productivity of the semiconductor device can be improved. |
| format | Patent |
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A spacing defined between the die pad and the leads is sized, i.e. made very small, that a flow velocity of a first portion of the molding resin flowing in a peripheral region of the semiconductor element becomes substantially equal to a flow velocity of a second portion of the molding resin flowing on at least an upper surface of the semiconductor element. That is, the first portion of the molding resin flowing in the peripheral region of the semiconductor element receives resistance due to the very small spacing between the die pad and the leads. Accordingly, the flow of the molding resin as a whole can be made uniform to thereby reduce or eliminate the generation of voids in the molding resin. As a result, reliability and productivity of the semiconductor device can be improved.</description><edition>5</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931207&DB=EPODOC&CC=US&NR=5268532A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931207&DB=EPODOC&CC=US&NR=5268532A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUKASAWA; HIROYUKI</creatorcontrib><creatorcontrib>MAKINO; HARUHIKO</creatorcontrib><title>Semiconductor device</title><description>A semiconductor device including a lead frame provided with a die pad and a plurality of leads arranged around the die pad, a semiconductor element mounted on the die pad, and a molding resin for sealing the semiconductor element. A spacing defined between the die pad and the leads is sized, i.e. made very small, that a flow velocity of a first portion of the molding resin flowing in a peripheral region of the semiconductor element becomes substantially equal to a flow velocity of a second portion of the molding resin flowing on at least an upper surface of the semiconductor element. That is, the first portion of the molding resin flowing in the peripheral region of the semiconductor element receives resistance due to the very small spacing between the die pad and the leads. Accordingly, the flow of the molding resin as a whole can be made uniform to thereby reduce or eliminate the generation of voids in the molding resin. As a result, reliability and productivity of the semiconductor device can be improved.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJTs3NTM7PSylNLskvUkhJLctMTuVhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfGhwaZGZhamxkaOxoRVAADnLCBS</recordid><startdate>19931207</startdate><enddate>19931207</enddate><creator>FUKASAWA; HIROYUKI</creator><creator>MAKINO; HARUHIKO</creator><scope>EVB</scope></search><sort><creationdate>19931207</creationdate><title>Semiconductor device</title><author>FUKASAWA; HIROYUKI ; MAKINO; HARUHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5268532A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><toplevel>online_resources</toplevel><creatorcontrib>FUKASAWA; HIROYUKI</creatorcontrib><creatorcontrib>MAKINO; HARUHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUKASAWA; HIROYUKI</au><au>MAKINO; HARUHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor device</title><date>1993-12-07</date><risdate>1993</risdate><abstract>A semiconductor device including a lead frame provided with a die pad and a plurality of leads arranged around the die pad, a semiconductor element mounted on the die pad, and a molding resin for sealing the semiconductor element. A spacing defined between the die pad and the leads is sized, i.e. made very small, that a flow velocity of a first portion of the molding resin flowing in a peripheral region of the semiconductor element becomes substantially equal to a flow velocity of a second portion of the molding resin flowing on at least an upper surface of the semiconductor element. That is, the first portion of the molding resin flowing in the peripheral region of the semiconductor element receives resistance due to the very small spacing between the die pad and the leads. Accordingly, the flow of the molding resin as a whole can be made uniform to thereby reduce or eliminate the generation of voids in the molding resin. As a result, reliability and productivity of the semiconductor device can be improved.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS |
| title | Semiconductor device |
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