Process for producing a printed wiring board

Process for producing a printed wiring board

A process for the production of a printed wiring board, which comprises preparing a copper-clad laminate having a through-hole formed by drilling; providing a first resist pattern on the surface of the copper-clad laminate so as to cover a portion to be formed as a conductor pattern; etching the cop...

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Hauptverfasser: KOBAYASHI, TADASHI, SHIMODA, HIDETOSHI, TAKAHASHI, TOSHIO, UCHIDA, HIROYUKI
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator KOBAYASHI
TADASHI
SHIMODA
HIDETOSHI
TAKAHASHI
TOSHIO
UCHIDA
HIROYUKI
description A process for the production of a printed wiring board, which comprises preparing a copper-clad laminate having a through-hole formed by drilling; providing a first resist pattern on the surface of the copper-clad laminate so as to cover a portion to be formed as a conductor pattern; etching the copper-clad laminate; removing the first resist pattern; subjecting the whole laminate to an electroless copper plating; laminating a dry film resist on the copper-clad laminate; exposing and developing the dry film resist to form a second resist pattern in such a manner that the through-hole and a portion to be plated are exposed; subjecting the exposed portions to an electrolytic copper plating; removing the second resist pattern; and removing the exposed electroless copper plating through etching.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Process for producing a printed wiring board
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