HERMETIC PACKAGE FOR AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME

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Hauptverfasser: CHANCE, DUDLEY A, TONG, HO-MING, GOLAND, DAVID B
Format: Patent
Sprache:eng
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creator CHANCE
DUDLEY A
TONG
HO-MING
GOLAND
DAVID B
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US5194196A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US5194196A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US5194196A3</originalsourceid><addsrcrecordid>eNrjZPDycA3ydQ3xdFYIcHT2dnR3VXDzD1Jw9FNw9XF1Dgny9wPKuLiGeTq7AgVdFIBKPfxdFPzdFHwd_ULdHJ1DQoM8_dwVgh19XXkYWNMSc4pTeaE0N4O8m2uIs4duakF-fGpxQWJyal5qSXxosKmhpYmhpZmjMWEVAHVWLE8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HERMETIC PACKAGE FOR AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME</title><source>esp@cenet</source><creator>CHANCE; DUDLEY A ; TONG; HO-MING ; GOLAND; DAVID B</creator><creatorcontrib>CHANCE; DUDLEY A ; TONG; HO-MING ; GOLAND; DAVID B</creatorcontrib><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19930316&amp;DB=EPODOC&amp;CC=US&amp;NR=5194196A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19930316&amp;DB=EPODOC&amp;CC=US&amp;NR=5194196A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHANCE; DUDLEY A</creatorcontrib><creatorcontrib>TONG; HO-MING</creatorcontrib><creatorcontrib>GOLAND; DAVID B</creatorcontrib><title>HERMETIC PACKAGE FOR AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME</title><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDycA3ydQ3xdFYIcHT2dnR3VXDzD1Jw9FNw9XF1Dgny9wPKuLiGeTq7AgVdFIBKPfxdFPzdFHwd_ULdHJ1DQoM8_dwVgh19XXkYWNMSc4pTeaE0N4O8m2uIs4duakF-fGpxQWJyal5qSXxosKmhpYmhpZmjMWEVAHVWLE8</recordid><startdate>19930316</startdate><enddate>19930316</enddate><creator>CHANCE; DUDLEY A</creator><creator>TONG; HO-MING</creator><creator>GOLAND; DAVID B</creator><scope>EVB</scope></search><sort><creationdate>19930316</creationdate><title>HERMETIC PACKAGE FOR AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME</title><author>CHANCE; DUDLEY A ; TONG; HO-MING ; GOLAND; DAVID B</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5194196A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHANCE; DUDLEY A</creatorcontrib><creatorcontrib>TONG; HO-MING</creatorcontrib><creatorcontrib>GOLAND; DAVID B</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHANCE; DUDLEY A</au><au>TONG; HO-MING</au><au>GOLAND; DAVID B</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HERMETIC PACKAGE FOR AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME</title><date>1993-03-16</date><risdate>1993</risdate><oa>free_for_read</oa></addata></record>
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recordid cdi_epo_espacenet_US5194196A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title HERMETIC PACKAGE FOR AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T14%3A53%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHANCE;%20DUDLEY%20A&rft.date=1993-03-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS5194196A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true