Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same

A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by prov...

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Bibliographische Detailangaben
Hauptverfasser:	EDWIN, ERIC R, WILSON, JEROME A, TUMLINSON, JAMES J, MEYER, ROLLIN G, MCKENNEY, DARRYL J, MCMILLAN, JR., THAD C
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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