Cooling structure of a test head for IC tester

There is disclosed a cooling structure of a test head for IC tester capable of effectively cooling ICs mounted on printed boards. The ICs can be cooled by providing a hinge between the printed boards disposed around a pipe, retaining cooling plates having a conduit by the hinge and flowing fluid hav...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUZUKI, SHINYA, HIROSE, SEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSTRUMENT DETAILS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TESTING
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