Method for fabricating a multichip semiconductor device having two interdigitated leadframes

A packaged semiconductor device is disclosed having at least two electronic components encapsulated in a single body of standard size and pin-out configuration. In accordance with one embodiment of this invention, two leadframes, having electronic components electrically coupled thereto, are positio...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CASTO, JAMES J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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