ELIMINATION OF ETCH STOP UNDERCUT

Two methods for wet etch removing an etch stop layer without leaving an undesired undercut are disclosed. In the first method, a reactive ion etch is stopped on an etch stop layer. The exposed etch stop is wet etch removed, leaving an undesirable undercut. The undercut is filled by chemical vapor de...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CRONIN, JOHN E, LAKRITZ, MARK N
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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