Gas barrier layer for metallic and nonmetallic materials
The invention provides a high-purity electroaluminum layer having a purity of greater than 99.99% and, preferably, a thickness of 10 to 20 mu m which serves as a gas barrier layer, particularly for hydrogen, oxygen, tritium and water vapor, for metallic materials and nonmetallic materials such as gl...
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| creator | DOETZER RICHARD IWANTSCHEFF GEORG |
| description | The invention provides a high-purity electroaluminum layer having a purity of greater than 99.99% and, preferably, a thickness of 10 to 20 mu m which serves as a gas barrier layer, particularly for hydrogen, oxygen, tritium and water vapor, for metallic materials and nonmetallic materials such as glass, quartz, ceramic and cermets with an electroconductive surface as well as for conductive plastics. By post-treatment, the electroaluminum layer can be compacted. The electroaluminum layer is precipitated by electroplating from aprotic oxygen-free and anhydrous electrolyte media of the general formula MIX.2AlR3.nLsm, wherein MI is an alkali metal ion or a quaternary onium ion, X is a halogen ion, preferably F- or Cl-, R is an alkyl radical, preferably CH3, C2H5, C3H7 or C4H9, Lsm is an aromatic solvent molecule, preferably toluene, ethyl benzene, xylene or a mixture thereof, and n=0 to 12, at a bath temperature of 50 DEG to 110 DEG C. and a current density of 0.5 to 10 A/dm2 under intensive bath agitation. Electroplating may be conducted in the presence of an aromatic solvent. |
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By post-treatment, the electroaluminum layer can be compacted. The electroaluminum layer is precipitated by electroplating from aprotic oxygen-free and anhydrous electrolyte media of the general formula MIX.2AlR3.nLsm, wherein MI is an alkali metal ion or a quaternary onium ion, X is a halogen ion, preferably F- or Cl-, R is an alkyl radical, preferably CH3, C2H5, C3H7 or C4H9, Lsm is an aromatic solvent molecule, preferably toluene, ethyl benzene, xylene or a mixture thereof, and n=0 to 12, at a bath temperature of 50 DEG to 110 DEG C. and a current density of 0.5 to 10 A/dm2 under intensive bath agitation. Electroplating may be conducted in the presence of an aromatic solvent.</description><language>eng</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; BLASTING ; CABLES ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; CONDUCTORS ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; ENGINEERING ELEMENTS AND UNITS ; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; GLASS ; HEATING ; INSULATORS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; JOINTS OR FITTINGS FOR PIPES ; LIGHTING ; MEANS FOR THERMAL INSULATION IN GENERAL ; MECHANICAL ENGINEERING ; METALLURGY ; MINERAL OR SLAG WOOL ; NUCLEAR ENGINEERING ; NUCLEAR PHYSICS ; NUCLEAR REACTORS ; PHYSICS ; PIPES ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE ; THERMAL INSULATION IN GENERAL ; WEAPONS</subject><creationdate>1990</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19900821&DB=EPODOC&CC=US&NR=4950551A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19900821&DB=EPODOC&CC=US&NR=4950551A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DOETZER; RICHARD</creatorcontrib><creatorcontrib>IWANTSCHEFF; GEORG</creatorcontrib><title>Gas barrier layer for metallic and nonmetallic materials</title><description>The invention provides a high-purity electroaluminum layer having a purity of greater than 99.99% and, preferably, a thickness of 10 to 20 mu m which serves as a gas barrier layer, particularly for hydrogen, oxygen, tritium and water vapor, for metallic materials and nonmetallic materials such as glass, quartz, ceramic and cermets with an electroconductive surface as well as for conductive plastics. By post-treatment, the electroaluminum layer can be compacted. The electroaluminum layer is precipitated by electroplating from aprotic oxygen-free and anhydrous electrolyte media of the general formula MIX.2AlR3.nLsm, wherein MI is an alkali metal ion or a quaternary onium ion, X is a halogen ion, preferably F- or Cl-, R is an alkyl radical, preferably CH3, C2H5, C3H7 or C4H9, Lsm is an aromatic solvent molecule, preferably toluene, ethyl benzene, xylene or a mixture thereof, and n=0 to 12, at a bath temperature of 50 DEG to 110 DEG C. and a current density of 0.5 to 10 A/dm2 under intensive bath agitation. Electroplating may be conducted in the presence of an aromatic solvent.</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CABLES</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>ENGINEERING ELEMENTS AND UNITS</subject><subject>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>GLASS</subject><subject>HEATING</subject><subject>INSULATORS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>JOINTS OR FITTINGS FOR PIPES</subject><subject>LIGHTING</subject><subject>MEANS FOR THERMAL INSULATION IN GENERAL</subject><subject>MECHANICAL ENGINEERING</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>NUCLEAR ENGINEERING</subject><subject>NUCLEAR PHYSICS</subject><subject>NUCLEAR REACTORS</subject><subject>PHYSICS</subject><subject>PIPES</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><subject>THERMAL INSULATION IN GENERAL</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1990</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBwTyxWSEosKspMLVLISawEkmn5RQq5qSWJOTmZyQqJeSkKefl5cH5uYklqUWZiTjEPA2sakErlhdLcDPJuriHOHrqpBfnxqcUFicmpeakl8aHBJpamBqamho7GhFUAAEudLZ8</recordid><startdate>19900821</startdate><enddate>19900821</enddate><creator>DOETZER; RICHARD</creator><creator>IWANTSCHEFF; GEORG</creator><scope>EVB</scope></search><sort><creationdate>19900821</creationdate><title>Gas barrier layer for metallic and nonmetallic materials</title><author>DOETZER; RICHARD ; IWANTSCHEFF; GEORG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US4950551A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1990</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CABLES</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>ENGINEERING ELEMENTS AND UNITS</topic><topic>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>GLASS</topic><topic>HEATING</topic><topic>INSULATORS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>JOINTS OR FITTINGS FOR PIPES</topic><topic>LIGHTING</topic><topic>MEANS FOR THERMAL INSULATION IN GENERAL</topic><topic>MECHANICAL ENGINEERING</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>NUCLEAR ENGINEERING</topic><topic>NUCLEAR PHYSICS</topic><topic>NUCLEAR REACTORS</topic><topic>PHYSICS</topic><topic>PIPES</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</topic><topic>THERMAL INSULATION IN GENERAL</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>DOETZER; RICHARD</creatorcontrib><creatorcontrib>IWANTSCHEFF; GEORG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DOETZER; RICHARD</au><au>IWANTSCHEFF; GEORG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Gas barrier layer for metallic and nonmetallic materials</title><date>1990-08-21</date><risdate>1990</risdate><abstract>The invention provides a high-purity electroaluminum layer having a purity of greater than 99.99% and, preferably, a thickness of 10 to 20 mu m which serves as a gas barrier layer, particularly for hydrogen, oxygen, tritium and water vapor, for metallic materials and nonmetallic materials such as glass, quartz, ceramic and cermets with an electroconductive surface as well as for conductive plastics. By post-treatment, the electroaluminum layer can be compacted. The electroaluminum layer is precipitated by electroplating from aprotic oxygen-free and anhydrous electrolyte media of the general formula MIX.2AlR3.nLsm, wherein MI is an alkali metal ion or a quaternary onium ion, X is a halogen ion, preferably F- or Cl-, R is an alkyl radical, preferably CH3, C2H5, C3H7 or C4H9, Lsm is an aromatic solvent molecule, preferably toluene, ethyl benzene, xylene or a mixture thereof, and n=0 to 12, at a bath temperature of 50 DEG to 110 DEG C. and a current density of 0.5 to 10 A/dm2 under intensive bath agitation. Electroplating may be conducted in the presence of an aromatic solvent.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS BLASTING CABLES CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CONDUCTORS ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GLASS HEATING INSULATORS JOINING GLASS TO GLASS OR OTHER MATERIALS JOINTS OR FITTINGS FOR PIPES LIGHTING MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING METALLURGY MINERAL OR SLAG WOOL NUCLEAR ENGINEERING NUCLEAR PHYSICS NUCLEAR REACTORS PHYSICS PIPES PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE THERMAL INSULATION IN GENERAL WEAPONS |
| title | Gas barrier layer for metallic and nonmetallic materials |
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