Heat sink for an electronic device

Heat sink for an electronic device

A heat sink for conducting heat from an electronic device is disclosed. The device has a mounting base and two U-shaped members. Each U-shaped member has first and second walls integral with a top ridge. The first wall is integral with the base and extends away from the base and the second wall has...

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Hauptverfasser: BULMAHN, DAVID J, JONES, JACK E
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator BULMAHN
DAVID J
JONES
JACK E
description A heat sink for conducting heat from an electronic device is disclosed. The device has a mounting base and two U-shaped members. Each U-shaped member has first and second walls integral with a top ridge. The first wall is integral with the base and extends away from the base and the second wall has a terminus portion proximate the first wall. Each U-shaped member is adapted to retain an electronic device between the first wall and the terminus portion.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Heat sink for an electronic device
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