Method and apparatus for adhering a tape or sheet to a semiconductor wafer
A method and apparatus for adhering an adhesive-backed tape or sheet to a surface of a semiconductor wafer. The apparatus comprises a housing forming a vacuum working chamber containing a supporting table for the semiconductor wafer and a plurality of rollers for exerting pressure on an adhesive-bac...
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| creator | OKAMOTO TADAHIRO |
| description | A method and apparatus for adhering an adhesive-backed tape or sheet to a surface of a semiconductor wafer. The apparatus comprises a housing forming a vacuum working chamber containing a supporting table for the semiconductor wafer and a plurality of rollers for exerting pressure on an adhesive-backed tape or sheet and pressing it against the wafer surface. The rollers comprise rubber rollers having different axial lengths so that, even if the wafer is warped, the tape or sheet can be uniformly adhered to the whole surface of the wafer. |
| format | Patent |
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The apparatus comprises a housing forming a vacuum working chamber containing a supporting table for the semiconductor wafer and a plurality of rollers for exerting pressure on an adhesive-backed tape or sheet and pressing it against the wafer surface. The rollers comprise rubber rollers having different axial lengths so that, even if the wafer is warped, the tape or sheet can be uniformly adhered to the whole surface of the wafer.</description><edition>4</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVEYING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING THIN OR FILAMENTARY MATERIAL ; HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES ; PACKING ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; STORING ; TRANSPORTING ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19881129&DB=EPODOC&CC=US&NR=4787951A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19881129&DB=EPODOC&CC=US&NR=4787951A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKAMOTO; TADAHIRO</creatorcontrib><title>Method and apparatus for adhering a tape or sheet to a semiconductor wafer</title><description>A method and apparatus for adhering an adhesive-backed tape or sheet to a surface of a semiconductor wafer. 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The apparatus comprises a housing forming a vacuum working chamber containing a supporting table for the semiconductor wafer and a plurality of rollers for exerting pressure on an adhesive-backed tape or sheet and pressing it against the wafer surface. The rollers comprise rubber rollers having different axial lengths so that, even if the wafer is warped, the tape or sheet can be uniformly adhered to the whole surface of the wafer.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES PACKING PERFORMING OPERATIONS SEMICONDUCTOR DEVICES STORING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
| title | Method and apparatus for adhering a tape or sheet to a semiconductor wafer |
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