Method of producing printed circuit boards

A method of producing printed circuit boards comprises the steps of applying a first solder resist on the conductor circuit pattern so as to surround lands to be soldered in the pattern and then applying a second solder resist to the whole surface of the pattern so as to leave portions having a size...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BIRUKAWA, FUSAO, OHTANI, YASUAKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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