Method of producing printed circuit boards

Method of producing printed circuit boards

A method of producing printed circuit boards comprises the steps of applying a first solder resist on the conductor circuit pattern so as to surround lands to be soldered in the pattern and then applying a second solder resist to the whole surface of the pattern so as to leave portions having a size...

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Hauptverfasser: BIRUKAWA, FUSAO, OHTANI, YASUAKI
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator BIRUKAWA
FUSAO
OHTANI
YASUAKI
description A method of producing printed circuit boards comprises the steps of applying a first solder resist on the conductor circuit pattern so as to surround lands to be soldered in the pattern and then applying a second solder resist to the whole surface of the pattern so as to leave portions having a size larger than the size of the land and smaller than the outer diameter of the first solder resist.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Method of producing printed circuit boards
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