Heat-dissipating socket connector for leaded modules

The socket connector (10) (see Fig. 2) connects individual leads (12) of a leaded module (14) to individual circuits (18) on a printed circuit board (22) and comprises a unitary molded dielectric frame (24) including a module-receiving recess (26). The frame is cantedly mounted on the circuit board...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WALSE, ALAN S, RISHWORTH, PAUL L
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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