Heat-dissipating socket connector for leaded modules
The socket connector (10) (see Fig. 2) connects individual leads (12) of a leaded module (14) to individual circuits (18) on a printed circuit board (22) and comprises a unitary molded dielectric frame (24) including a module-receiving recess (26). The frame is cantedly mounted on the circuit board...
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| creator | WALSE ALAN S RISHWORTH PAUL L |
| description | The socket connector (10) (see Fig. 2) connects individual leads (12) of a leaded module (14) to individual circuits (18) on a printed circuit board (22) and comprises a unitary molded dielectric frame (24) including a module-receiving recess (26). The frame is cantedly mounted on the circuit board (22) with the recess (26) disposed at an angle with respect to the printed board surface (20). Compliant terminals (56, 94) are mounted in generally open terminal receiving cavities (54, 74) within the frame (24) which are adapted to engage side portions (118) of leads (12) on an inserted module (14). Openings (84) within the frame (24) together with an exposed terminal mounting arrangement for terminals (56, 94) provide ventilation and airflow exposure for portions of the connector (10) and module (14) susceptible to the generation of high temperatures in use. |
| format | Patent |
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The frame is cantedly mounted on the circuit board (22) with the recess (26) disposed at an angle with respect to the printed board surface (20). Compliant terminals (56, 94) are mounted in generally open terminal receiving cavities (54, 74) within the frame (24) which are adapted to engage side portions (118) of leads (12) on an inserted module (14). Openings (84) within the frame (24) together with an exposed terminal mounting arrangement for terminals (56, 94) provide ventilation and airflow exposure for portions of the connector (10) and module (14) susceptible to the generation of high temperatures in use.</description><edition>4</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880705&DB=EPODOC&CC=US&NR=4755146A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880705&DB=EPODOC&CC=US&NR=4755146A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WALSE; ALAN S</creatorcontrib><creatorcontrib>RISHWORTH; PAUL L</creatorcontrib><title>Heat-dissipating socket connector for leaded modules</title><description>The socket connector (10) (see Fig. 2) connects individual leads (12) of a leaded module (14) to individual circuits (18) on a printed circuit board (22) and comprises a unitary molded dielectric frame (24) including a module-receiving recess (26). The frame is cantedly mounted on the circuit board (22) with the recess (26) disposed at an angle with respect to the printed board surface (20). Compliant terminals (56, 94) are mounted in generally open terminal receiving cavities (54, 74) within the frame (24) which are adapted to engage side portions (118) of leads (12) on an inserted module (14). Openings (84) within the frame (24) together with an exposed terminal mounting arrangement for terminals (56, 94) provide ventilation and airflow exposure for portions of the connector (10) and module (14) susceptible to the generation of high temperatures in use.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1988</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDxSE0s0U3JLC7OLEgsycxLVyjOT85OLVFIzs_LS00uyS9SSAPinNTElNQUhdz8lNKc1GIeBta0xJziVF4ozc0g7-Ya4uyhm1qQH59aXJCYnJqXWhIfGmxibmpqaGLmaExYBQCiRixm</recordid><startdate>19880705</startdate><enddate>19880705</enddate><creator>WALSE; ALAN S</creator><creator>RISHWORTH; PAUL L</creator><scope>EVB</scope></search><sort><creationdate>19880705</creationdate><title>Heat-dissipating socket connector for leaded modules</title><author>WALSE; ALAN S ; RISHWORTH; PAUL L</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US4755146A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1988</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WALSE; ALAN S</creatorcontrib><creatorcontrib>RISHWORTH; PAUL L</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WALSE; ALAN S</au><au>RISHWORTH; PAUL L</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat-dissipating socket connector for leaded modules</title><date>1988-07-05</date><risdate>1988</risdate><abstract>The socket connector (10) (see Fig. 2) connects individual leads (12) of a leaded module (14) to individual circuits (18) on a printed circuit board (22) and comprises a unitary molded dielectric frame (24) including a module-receiving recess (26). The frame is cantedly mounted on the circuit board (22) with the recess (26) disposed at an angle with respect to the printed board surface (20). Compliant terminals (56, 94) are mounted in generally open terminal receiving cavities (54, 74) within the frame (24) which are adapted to engage side portions (118) of leads (12) on an inserted module (14). Openings (84) within the frame (24) together with an exposed terminal mounting arrangement for terminals (56, 94) provide ventilation and airflow exposure for portions of the connector (10) and module (14) susceptible to the generation of high temperatures in use.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Heat-dissipating socket connector for leaded modules |
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