Low stress mounting of integrated optic chips

Low stress mounting of integrated optic chips

An integrated optic IO device chip with anisotropic thermal expansion properties is packaged in a material enclosure by first bonding the chip to a substrate having anisotropic thermal expansion properties substantially equivalent to those of the IO device and substrate thickness substantially great...

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Hauptverfasser: LOPICCOLO, MARIO T, SWARTS, RICHARD E, FOURNIER, JOSEPH T
Format: Patent
Sprache:eng
Schlagworte:
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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creator LOPICCOLO
MARIO T
SWARTS
RICHARD E
FOURNIER
JOSEPH T
description An integrated optic IO device chip with anisotropic thermal expansion properties is packaged in a material enclosure by first bonding the chip to a substrate having anisotropic thermal expansion properties substantially equivalent to those of the IO device and substrate thickness substantially greater than that of the IO device, and bonding the substrate to the enclosure.
format Patent
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subjects OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
title Low stress mounting of integrated optic chips
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