Method and apparatus for applying a connector having an injection molded cover to multiconductor cable

A method and apparatus for injection molding a connector cover half of a connector staked to a flat multiconductor cable are disclosed, which injection molding is carried out by reciprocating an injection molding device toward and away from the cable and staking connector half diametrically opposite the injection molding device. Appropriate thermoplastic resin is chosen as the injection molding material, such that its melting temperature is lower than the softening temperature of the plastic of the staking connector half, so that when the front face of the staking connector serves as the front wall sealing off the die cavity of the injection molding device, no deformation of the staking connector half occurs. The forming die of the device may be either air cooled or water cooled, or both, to speed hardening and to prevent deformation of the staking connector half.