Process for the deposition of metals on semiconductor powders

Gold, silver or palladium can be deposited by photoredox reaction on semiconductor oxide powders by irradiating a suspension of semiconductor oxide powder in the presence of oxygen, CO2 or mixtures thereof, of an oxidizable system which protects the semiconductor from photocorrosion, and of a salt o...

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Hauptverfasser: BUEHLER, NIKLAUS, REBER, JEAN-FRANCOIS, MEIER, KURT
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creator BUEHLER
NIKLAUS
REBER
JEAN-FRANCOIS
MEIER
KURT
description Gold, silver or palladium can be deposited by photoredox reaction on semiconductor oxide powders by irradiating a suspension of semiconductor oxide powder in the presence of oxygen, CO2 or mixtures thereof, of an oxidizable system which protects the semiconductor from photocorrosion, and of a salt or complex of copper, lead, mercury, tin, gold, silver or palladium.
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subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
FERROUS OR NON-FERROUS ALLOYS
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
PRETREATMENT OF RAW MATERIALS
PRODUCTION AND REFINING OF METALS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TREATMENT OF ALLOYS OR NON-FERROUS METALS
title Process for the deposition of metals on semiconductor powders
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