Method for forming elongated solder connections between a semiconductor device and a supporting substrate

A process for forming elongated solder terminals to connect a plurality of pads on a semiconductor device to a corresponding plurality of pads on a supporting substrate by, forming a means to maintain a predetermined vertical spacing between the semiconductor and the supporting substrate outside the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TUBIOLA, PETER J, ORDONEZ, JOSE, LAKRITZ, MARK N
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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