Telescoping thermal conduction element for semiconductor devices
A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between...
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| creator | LIPSCHUTZ LEWIS D HORVATH JOSEPH L BALDERES DEMETRIOS |
| description | A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between the first and second members. |
| format | Patent |
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BLASTING ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>1984</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19841120&DB=EPODOC&CC=US&NR=4483389A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19841120&DB=EPODOC&CC=US&NR=4483389A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIPSCHUTZ; 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LEWIS D</creatorcontrib><creatorcontrib>HORVATH; JOSEPH L</creatorcontrib><creatorcontrib>BALDERES; DEMETRIOS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIPSCHUTZ; LEWIS D</au><au>HORVATH; JOSEPH L</au><au>BALDERES; DEMETRIOS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Telescoping thermal conduction element for semiconductor devices</title><date>1984-11-20</date><risdate>1984</risdate><abstract>A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between the first and second members.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS |
| title | Telescoping thermal conduction element for semiconductor devices |
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