Cooling element for solder bonded semiconductor devices

An improved electronic package having a support substrate, at least one electronic device mounted on the substrate, a cover mounted on the substrate disposed over said device and having a surface in spaced proximity to the device, the improvement being: a thermal bridge for conducting heat from the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MEAGHER, RALPH E, PRESTI, FRANK P, LIPSCHUTZ, LEWIS D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An improved electronic package having a support substrate, at least one electronic device mounted on the substrate, a cover mounted on the substrate disposed over said device and having a surface in spaced proximity to the device, the improvement being: a thermal bridge for conducting heat from the device to the cover which includes a relatively thick metal sheet provided with cuts that define at least one tab element, grooves in the tab element that make it bendable, and a spring means to selectively urge the tab element into contact with the device.