Assembly of an electronic device on an insulative substrate
An electronic device, such as an integrated circuit formed on a single semiconductor chip, is mounted on a relatively flat insulative substrate, such as a chip carrier or printed circuit board, and electrically connected to electrical conductors on the substrate by means of a bonding material dispos...
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| creator | TEST, II HOWARD R |
| description | An electronic device, such as an integrated circuit formed on a single semiconductor chip, is mounted on a relatively flat insulative substrate, such as a chip carrier or printed circuit board, and electrically connected to electrical conductors on the substrate by means of a bonding material disposed between the device and substrate. The device is placed on the substrate with its electrically active surface in facing relationship with the substrate and with its electrical contact pads in registration with selected ones of the substrate conductors. The bonding material is substantially electrically conductive only along one axis which is orthogonal to the major planes of the device and substrate to provide an electrically conductive path between the contact pads and electrical conductors. The bonding material is allowed to accumulate along the perimeter of the electronic device to form a protective seal between the electronic device and the substrate. |
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The device is placed on the substrate with its electrically active surface in facing relationship with the substrate and with its electrical contact pads in registration with selected ones of the substrate conductors. The bonding material is substantially electrically conductive only along one axis which is orthogonal to the major planes of the device and substrate to provide an electrically conductive path between the contact pads and electrical conductors. The bonding material is allowed to accumulate along the perimeter of the electronic device to form a protective seal between the electronic device and the substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1983</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19831227&DB=EPODOC&CC=US&NR=4423435A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19831227&DB=EPODOC&CC=US&NR=4423435A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TEST, II; HOWARD R</creatorcontrib><title>Assembly of an electronic device on an insulative substrate</title><description>An electronic device, such as an integrated circuit formed on a single semiconductor chip, is mounted on a relatively flat insulative substrate, such as a chip carrier or printed circuit board, and electrically connected to electrical conductors on the substrate by means of a bonding material disposed between the device and substrate. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Assembly of an electronic device on an insulative substrate |
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