Double polysilicon contact structure and process

A contact structure in a double polysilicon device is described in which direct shorts between overlying polysilicon conductors due to a "polysilicon void phenomenon" is overcome by patterning an appropriate etch stop between the conductors.

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Bibliographische Detailangaben
Hauptverfasser: MAKAREWICZ, STANLEY R, REVITZ, MARTIN, SHEPARD, JOSEPH F, GARDINER, JAMES R
Format: Patent
Sprache:eng
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Zusammenfassung:A contact structure in a double polysilicon device is described in which direct shorts between overlying polysilicon conductors due to a "polysilicon void phenomenon" is overcome by patterning an appropriate etch stop between the conductors.