Solderable layer system, its use and method for manufacturing same
In order to bring about durable solder joints on transparent thin film electrodes which themselves are not solderable, the conductive layer is treated as follows. First, the conductive layer is applied in a vacuum and, more specifically, in the fully oxidized state, and then a solderable layer is ge...
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| creator | ROELKE HANS J SCHUSTER-WOLDEN HANS WELSCH WOLFGANG FRELLER HELMUT KRUEGER HANS SCHACK PETER PEETERMANS ANDRE |
| description | In order to bring about durable solder joints on transparent thin film electrodes which themselves are not solderable, the conductive layer is treated as follows. First, the conductive layer is applied in a vacuum and, more specifically, in the fully oxidized state, and then a solderable layer is generated on the conductive layer in the same vacuum. The electrode consists preferably of an indiumtin oxide and the solder layer consists of copper. The proposed coating technique is particularly simple since the solder layer requires neither an adhesion aid nor a corrosion protection layer. If it consists of copper, it can withstand without difficulty, if it is thick enough, even small thermal stresses such as occur for instance in the fabrication of liquid crystal displays with cementing frame. The layer system is particularly well suited for the electrode leads of electro-optical displays such as liquid crystal displays. |
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First, the conductive layer is applied in a vacuum and, more specifically, in the fully oxidized state, and then a solderable layer is generated on the conductive layer in the same vacuum. The electrode consists preferably of an indiumtin oxide and the solder layer consists of copper. The proposed coating technique is particularly simple since the solder layer requires neither an adhesion aid nor a corrosion protection layer. If it consists of copper, it can withstand without difficulty, if it is thick enough, even small thermal stresses such as occur for instance in the fabrication of liquid crystal displays with cementing frame. The layer system is particularly well suited for the electrode leads of electro-optical displays such as liquid crystal displays.</description><language>eng</language><subject>ADVERTISING ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; CONDUCTORS ; CRYPTOGRAPHY ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; DISPLAY ; DISPLAYING ; EDUCATION ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FREQUENCY-CHANGING ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; INSULATORS ; LABELS OR NAME-PLATES ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; NON-LINEAR OPTICS ; OPTICAL ANALOGUE/DIGITAL CONVERTERS ; OPTICAL LOGIC ELEMENTS ; OPTICS ; PERFORMING OPERATIONS ; PHYSICS ; PRINTED CIRCUITS ; SEALS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SIGNS ; SOLDERING OR UNSOLDERING ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1983</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19830531&DB=EPODOC&CC=US&NR=4385976A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19830531&DB=EPODOC&CC=US&NR=4385976A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ROELKE; HANS J</creatorcontrib><creatorcontrib>SCHUSTER-WOLDEN; HANS</creatorcontrib><creatorcontrib>WELSCH; WOLFGANG</creatorcontrib><creatorcontrib>FRELLER; HELMUT</creatorcontrib><creatorcontrib>KRUEGER; HANS</creatorcontrib><creatorcontrib>SCHACK; PETER</creatorcontrib><creatorcontrib>PEETERMANS; ANDRE</creatorcontrib><title>Solderable layer system, its use and method for manufacturing same</title><description>In order to bring about durable solder joints on transparent thin film electrodes which themselves are not solderable, the conductive layer is treated as follows. First, the conductive layer is applied in a vacuum and, more specifically, in the fully oxidized state, and then a solderable layer is generated on the conductive layer in the same vacuum. The electrode consists preferably of an indiumtin oxide and the solder layer consists of copper. The proposed coating technique is particularly simple since the solder layer requires neither an adhesion aid nor a corrosion protection layer. If it consists of copper, it can withstand without difficulty, if it is thick enough, even small thermal stresses such as occur for instance in the fabrication of liquid crystal displays with cementing frame. The layer system is particularly well suited for the electrode leads of electro-optical displays such as liquid crystal displays.</description><subject>ADVERTISING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>CONDUCTORS</subject><subject>CRYPTOGRAPHY</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>DISPLAY</subject><subject>DISPLAYING</subject><subject>EDUCATION</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FREQUENCY-CHANGING</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>INSULATORS</subject><subject>LABELS OR NAME-PLATES</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>NON-LINEAR OPTICS</subject><subject>OPTICAL ANALOGUE/DIGITAL CONVERTERS</subject><subject>OPTICAL LOGIC ELEMENTS</subject><subject>OPTICS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEALS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SIGNS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1983</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFyjkOwjAQBVA3FAg4A3MAqMJaJghEH6ijIf6GSF4iz7jI7WnoqV7z5qZpk7fI_PIgzxMyySSKsKFBhYqAOFoK0E-y5FKmwLE47rXkIb5JOGBpZo69YPVzYda36-Ny32JMHWTkHhHaPdtdddqfj4e6-j--cxAxZA</recordid><startdate>19830531</startdate><enddate>19830531</enddate><creator>ROELKE; HANS J</creator><creator>SCHUSTER-WOLDEN; HANS</creator><creator>WELSCH; WOLFGANG</creator><creator>FRELLER; HELMUT</creator><creator>KRUEGER; HANS</creator><creator>SCHACK; PETER</creator><creator>PEETERMANS; ANDRE</creator><scope>EVB</scope></search><sort><creationdate>19830531</creationdate><title>Solderable layer system, its use and method for manufacturing same</title><author>ROELKE; HANS J ; SCHUSTER-WOLDEN; HANS ; WELSCH; WOLFGANG ; FRELLER; HELMUT ; KRUEGER; HANS ; SCHACK; PETER ; PEETERMANS; ANDRE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US4385976A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1983</creationdate><topic>ADVERTISING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CONDUCTORS</topic><topic>CRYPTOGRAPHY</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>DISPLAY</topic><topic>DISPLAYING</topic><topic>EDUCATION</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FREQUENCY-CHANGING</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>INSULATORS</topic><topic>LABELS OR NAME-PLATES</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>NON-LINEAR OPTICS</topic><topic>OPTICAL ANALOGUE/DIGITAL CONVERTERS</topic><topic>OPTICAL LOGIC ELEMENTS</topic><topic>OPTICS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEALS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SIGNS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>ROELKE; HANS J</creatorcontrib><creatorcontrib>SCHUSTER-WOLDEN; HANS</creatorcontrib><creatorcontrib>WELSCH; WOLFGANG</creatorcontrib><creatorcontrib>FRELLER; HELMUT</creatorcontrib><creatorcontrib>KRUEGER; HANS</creatorcontrib><creatorcontrib>SCHACK; PETER</creatorcontrib><creatorcontrib>PEETERMANS; ANDRE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ROELKE; HANS J</au><au>SCHUSTER-WOLDEN; HANS</au><au>WELSCH; WOLFGANG</au><au>FRELLER; HELMUT</au><au>KRUEGER; HANS</au><au>SCHACK; PETER</au><au>PEETERMANS; ANDRE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Solderable layer system, its use and method for manufacturing same</title><date>1983-05-31</date><risdate>1983</risdate><abstract>In order to bring about durable solder joints on transparent thin film electrodes which themselves are not solderable, the conductive layer is treated as follows. First, the conductive layer is applied in a vacuum and, more specifically, in the fully oxidized state, and then a solderable layer is generated on the conductive layer in the same vacuum. The electrode consists preferably of an indiumtin oxide and the solder layer consists of copper. The proposed coating technique is particularly simple since the solder layer requires neither an adhesion aid nor a corrosion protection layer. If it consists of copper, it can withstand without difficulty, if it is thick enough, even small thermal stresses such as occur for instance in the fabrication of liquid crystal displays with cementing frame. The layer system is particularly well suited for the electrode leads of electro-optical displays such as liquid crystal displays.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADVERTISING BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS CRYPTOGRAPHY CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DIFFUSION TREATMENT OF METALLIC MATERIAL DISPLAY DISPLAYING EDUCATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS LABELS OR NAME-PLATES MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SEALS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SIGNS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Solderable layer system, its use and method for manufacturing same |
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