Enhanced condensation heat transfer device and method
A metal substrate is provided with a single layer of randomly distributed metal bodies bonded to the substrate, spaced from each other and substantially surrounded by the substrate to form active condensation heat transfer surface and body void space.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A metal substrate is provided with a single layer of randomly distributed metal bodies bonded to the substrate, spaced from each other and substantially surrounded by the substrate to form active condensation heat transfer surface and body void space. |
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