Enhanced condensation heat transfer device and method

A metal substrate is provided with a single layer of randomly distributed metal bodies bonded to the substrate, spaced from each other and substantially surrounded by the substrate to form active condensation heat transfer surface and body void space.

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NOTARO, FRANK
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A metal substrate is provided with a single layer of randomly distributed metal bodies bonded to the substrate, spaced from each other and substantially surrounded by the substrate to form active condensation heat transfer surface and body void space.