Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate

Integrated circuit chips are mounted in electronic assemblies with the chip terminal pads "up" or on the opposite side of the chip from the substrate of the circuit board. The lower chip surface is bonded either directly to the heat-conducting substrate or through an intermediate pedestal...

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Hauptverfasser:	LINDER, JACQUES F, GROSSMAN, NORMAN J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	LINDER JACQUES F GROSSMAN NORMAN J
description	Integrated circuit chips are mounted in electronic assemblies with the chip terminal pads "up" or on the opposite side of the chip from the substrate of the circuit board. The lower chip surface is bonded either directly to the heat-conducting substrate or through an intermediate pedestal of a good heat-conducting volume of metal. Beam leads from the integrated circuit terminals are bonded to relatively large heat-conductive posts acting as spacers, if necessary, between the beam leads and the circuitry pattern.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate
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