INTEGRATED CIRCUIT FABRICATION PROCESS

Integrated circuits of high density are fabricated in a simplified process which allows both the use of multiple conducting layers in a dielectric above a semiconductor substrate, such as a polycrystalline silicon (polysilicon) field shield and metal interconnection lines, while also making provisio...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GARNACHE R,US, SMITH W,US
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE PHYSICS SEMICONDUCTOR DEVICES STATIC STORES
Online-Zugang:	Volltext bestellen
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