PROCESS FOR HANDLING AND MOUNTING SEMICONDUCTOR DICE

1,239,882. Splitting. RCA CORPORATION. 22 May, 1969 [29 May, 1968], No. 26129/69. Heading B5E. [Also in Division H1] In a method of manufacture of semi-conductor components a plurality of separate semiconductor devices are formed in a unitary wafer which is scribed to define weakened fracture planes...

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Bibliographische Detailangaben

1. Verfasser:	ADAM FISCHER JR
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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