PROCESS FOR HANDLING AND MOUNTING SEMICONDUCTOR DICE

1,239,882. Splitting. RCA CORPORATION. 22 May, 1969 [29 May, 1968], No. 26129/69. Heading B5E. [Also in Division H1] In a method of manufacture of semi-conductor components a plurality of separate semiconductor devices are formed in a unitary wafer which is scribed to define weakened fracture planes between the devices, after which the wafer is detachably bonded to a flexible film and fractured along its weakened planes to separate the devices which remain attached to the film, and finally the film is stretched to separate the devices from one another and secured to an open frame. The flexible film is a thermoplastics film such as a thin plasticized vinyl and its surface may be textured to control the adherence of the devices. The fracturing of the wafer is accomplished by using a metal roller. Each device 23 is mounted on its individual header 21 by disposing it adjacent to its header and depressing a limited portion 26 of the film 3 opposite the die by means of a rod 25 to bring the device into contact with the header, bonding the device to the header by a thin layer or drop of adhesive such as epoxy resin, and releasing the depressed portion of the film so that it returns to its former position leaving the device on the header. In a further embodiment, an integrated circuit is mounted on its lead assembly in a similar manner, the device being soldered in position with its terminal pads contacting the appropriate leads.