Thixotropic, non-flowing adhesive bonding and jointing compositions and methods of bonding ceramic tiles to substrates using thixotropic, non-flowing adhesive bonding and jointing compositions

1,054,458. Amine terminated polyamides; epoxy-resin curing agents; foams. SELS ET PRODUITS CHIMIQUES SOC. ANON. Oct. 8, 1964 [Oct. 18, 1963], No. 41074/64. Headings C3B, C3C and C3R. A gel composition is composed of (a) water and (b) a polyamide prepared from a polyi carboxylic acid and a stoichiome...

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description 1,054,458. Amine terminated polyamides; epoxy-resin curing agents; foams. SELS ET PRODUITS CHIMIQUES SOC. ANON. Oct. 8, 1964 [Oct. 18, 1963], No. 41074/64. Headings C3B, C3C and C3R. A gel composition is composed of (a) water and (b) a polyamide prepared from a polyi carboxylic acid and a stoichiometric excess of a polyamine. 5-50% of water may be present. Polyamines specified are ethylene and propylene diamines, di-ethylene triamine, dipropylene triamine, triethylene tetramine, tripropylene tetramine, tetramethylene pentamine, tetrapropylene pentamine, the corresponding butylene, hexylene and octene derivatives and N-octadecenyl trimethylene diamine. Polycarboxylic acids specified are adipic, pimelic suberic, azelaic and sebacic acids, nonane dicarboxylic acid, citraconic, mesaconic, itaconic and dimerized resinic acids. 5-200% excess of polyamine may be used. The reactants may be mixed in a solvent, e.g. ethanol, which is then evaporated, polycondensation being effected at 100-200‹ C. The polyamide so formed may be up to 20% water soluble. The gel composition obtained when the polyamide is mixed with water may be used as a curing agent for liquid epoxy resins having terminal epoxy groups. Many monomeric and polymeric epoxy-resins are specified including adducts of epichlorohydrin to bisphenol A and to an o-cresol/formaldehyde novalak. Up to 500% of an inert filler of 50-400 mesh particle size may be added to either the gel or the epoxy resin before mixing. Fillers specified are asbestos, albalith, silica, mica, flint, quartz, cryolite, Portland cement, limestone, TiO 2 , activated alumina, barytes, talc, pyrophyllite, clays and diatomaceous earth, polystyrene, polyvinyl chloride, polyvinylidene chloride, poly(tetrafluoroethylene), poly-(trifluorochloroethylene) and siloxane resins. The epoxy-resins may be modified with 1-100% of reactive compounds, e.g. phenoplasts, aminoplasts, polyesters and monomeric diisocyanates. Several modifiers are specified. The composition may also contain pigments, e.g. TiO 2 , cadmium red, carbon black and aluminium powder. The product may be used for fixing tiles. In Example 6, an epichlorohydrin/bisphenol A condensate was hardened with a polyiminopolyamide in the presence of polystyrene, TiO 2 , barytes, SiO 2 , a blue pigment and water. The product was cellular, due to evaporation of the water.
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Amine terminated polyamides; epoxy-resin curing agents; foams. SELS ET PRODUITS CHIMIQUES SOC. ANON. Oct. 8, 1964 [Oct. 18, 1963], No. 41074/64. Headings C3B, C3C and C3R. A gel composition is composed of (a) water and (b) a polyamide prepared from a polyi carboxylic acid and a stoichiometric excess of a polyamine. 5-50% of water may be present. Polyamines specified are ethylene and propylene diamines, di-ethylene triamine, dipropylene triamine, triethylene tetramine, tripropylene tetramine, tetramethylene pentamine, tetrapropylene pentamine, the corresponding butylene, hexylene and octene derivatives and N-octadecenyl trimethylene diamine. Polycarboxylic acids specified are adipic, pimelic suberic, azelaic and sebacic acids, nonane dicarboxylic acid, citraconic, mesaconic, itaconic and dimerized resinic acids. 5-200% excess of polyamine may be used. The reactants may be mixed in a solvent, e.g. ethanol, which is then evaporated, polycondensation being effected at 100-200‹ C. The polyamide so formed may be up to 20% water soluble. The gel composition obtained when the polyamide is mixed with water may be used as a curing agent for liquid epoxy resins having terminal epoxy groups. Many monomeric and polymeric epoxy-resins are specified including adducts of epichlorohydrin to bisphenol A and to an o-cresol/formaldehyde novalak. Up to 500% of an inert filler of 50-400 mesh particle size may be added to either the gel or the epoxy resin before mixing. Fillers specified are asbestos, albalith, silica, mica, flint, quartz, cryolite, Portland cement, limestone, TiO 2 , activated alumina, barytes, talc, pyrophyllite, clays and diatomaceous earth, polystyrene, polyvinyl chloride, polyvinylidene chloride, poly(tetrafluoroethylene), poly-(trifluorochloroethylene) and siloxane resins. The epoxy-resins may be modified with 1-100% of reactive compounds, e.g. phenoplasts, aminoplasts, polyesters and monomeric diisocyanates. Several modifiers are specified. The composition may also contain pigments, e.g. TiO 2 , cadmium red, carbon black and aluminium powder. The product may be used for fixing tiles. In Example 6, an epichlorohydrin/bisphenol A condensate was hardened with a polyiminopolyamide in the presence of polystyrene, TiO 2 , barytes, SiO 2 , a blue pigment and water. 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Amine terminated polyamides; epoxy-resin curing agents; foams. SELS ET PRODUITS CHIMIQUES SOC. ANON. Oct. 8, 1964 [Oct. 18, 1963], No. 41074/64. Headings C3B, C3C and C3R. A gel composition is composed of (a) water and (b) a polyamide prepared from a polyi carboxylic acid and a stoichiometric excess of a polyamine. 5-50% of water may be present. Polyamines specified are ethylene and propylene diamines, di-ethylene triamine, dipropylene triamine, triethylene tetramine, tripropylene tetramine, tetramethylene pentamine, tetrapropylene pentamine, the corresponding butylene, hexylene and octene derivatives and N-octadecenyl trimethylene diamine. Polycarboxylic acids specified are adipic, pimelic suberic, azelaic and sebacic acids, nonane dicarboxylic acid, citraconic, mesaconic, itaconic and dimerized resinic acids. 5-200% excess of polyamine may be used. The reactants may be mixed in a solvent, e.g. ethanol, which is then evaporated, polycondensation being effected at 100-200‹ C. The polyamide so formed may be up to 20% water soluble. The gel composition obtained when the polyamide is mixed with water may be used as a curing agent for liquid epoxy resins having terminal epoxy groups. Many monomeric and polymeric epoxy-resins are specified including adducts of epichlorohydrin to bisphenol A and to an o-cresol/formaldehyde novalak. Up to 500% of an inert filler of 50-400 mesh particle size may be added to either the gel or the epoxy resin before mixing. Fillers specified are asbestos, albalith, silica, mica, flint, quartz, cryolite, Portland cement, limestone, TiO 2 , activated alumina, barytes, talc, pyrophyllite, clays and diatomaceous earth, polystyrene, polyvinyl chloride, polyvinylidene chloride, poly(tetrafluoroethylene), poly-(trifluorochloroethylene) and siloxane resins. The epoxy-resins may be modified with 1-100% of reactive compounds, e.g. phenoplasts, aminoplasts, polyesters and monomeric diisocyanates. Several modifiers are specified. The composition may also contain pigments, e.g. TiO 2 , cadmium red, carbon black and aluminium powder. The product may be used for fixing tiles. In Example 6, an epichlorohydrin/bisphenol A condensate was hardened with a polyiminopolyamide in the presence of polystyrene, TiO 2 , barytes, SiO 2 , a blue pigment and water. 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Amine terminated polyamides; epoxy-resin curing agents; foams. SELS ET PRODUITS CHIMIQUES SOC. ANON. Oct. 8, 1964 [Oct. 18, 1963], No. 41074/64. Headings C3B, C3C and C3R. A gel composition is composed of (a) water and (b) a polyamide prepared from a polyi carboxylic acid and a stoichiometric excess of a polyamine. 5-50% of water may be present. Polyamines specified are ethylene and propylene diamines, di-ethylene triamine, dipropylene triamine, triethylene tetramine, tripropylene tetramine, tetramethylene pentamine, tetrapropylene pentamine, the corresponding butylene, hexylene and octene derivatives and N-octadecenyl trimethylene diamine. Polycarboxylic acids specified are adipic, pimelic suberic, azelaic and sebacic acids, nonane dicarboxylic acid, citraconic, mesaconic, itaconic and dimerized resinic acids. 5-200% excess of polyamine may be used. The reactants may be mixed in a solvent, e.g. ethanol, which is then evaporated, polycondensation being effected at 100-200‹ C. The polyamide so formed may be up to 20% water soluble. The gel composition obtained when the polyamide is mixed with water may be used as a curing agent for liquid epoxy resins having terminal epoxy groups. Many monomeric and polymeric epoxy-resins are specified including adducts of epichlorohydrin to bisphenol A and to an o-cresol/formaldehyde novalak. Up to 500% of an inert filler of 50-400 mesh particle size may be added to either the gel or the epoxy resin before mixing. Fillers specified are asbestos, albalith, silica, mica, flint, quartz, cryolite, Portland cement, limestone, TiO 2 , activated alumina, barytes, talc, pyrophyllite, clays and diatomaceous earth, polystyrene, polyvinyl chloride, polyvinylidene chloride, poly(tetrafluoroethylene), poly-(trifluorochloroethylene) and siloxane resins. The epoxy-resins may be modified with 1-100% of reactive compounds, e.g. phenoplasts, aminoplasts, polyesters and monomeric diisocyanates. Several modifiers are specified. The composition may also contain pigments, e.g. TiO 2 , cadmium red, carbon black and aluminium powder. The product may be used for fixing tiles. In Example 6, an epichlorohydrin/bisphenol A condensate was hardened with a polyiminopolyamide in the presence of polystyrene, TiO 2 , barytes, SiO 2 , a blue pigment and water. The product was cellular, due to evaporation of the water.</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BUILDING
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
FIXED CONSTRUCTIONS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
title Thixotropic, non-flowing adhesive bonding and jointing compositions and methods of bonding ceramic tiles to substrates using thixotropic, non-flowing adhesive bonding and jointing compositions
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