SUBSTRATE PROCESSING METHOD
The present disclosure relates to a substrate processing method, and more particularly, to a substrate processing method of a substrate processing device using a supercritical fluid, to reduce damage or defects to a substrate when the supercritical fluid is supplied into the chamber.
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| creator | OH, Seung-Min JUNG, In-Il LEE, Jong-Seok |
| description | The present disclosure relates to a substrate processing method, and more particularly, to a substrate processing method of a substrate processing device using a supercritical fluid, to reduce damage or defects to a substrate when the supercritical fluid is supplied into the chamber. |
| format | Patent |
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CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2025</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20250102&DB=EPODOC&CC=US&NR=2025001467A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20250102&DB=EPODOC&CC=US&NR=2025001467A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OH, Seung-Min</creatorcontrib><creatorcontrib>JUNG, In-Il</creatorcontrib><creatorcontrib>LEE, Jong-Seok</creatorcontrib><title>SUBSTRATE PROCESSING METHOD</title><description>The present disclosure relates to a substrate processing method, and more particularly, to a substrate processing method of a substrate processing device using a supercritical fluid, to reduce damage or defects to a substrate when the supercritical fluid is supplied into the chamber.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2025</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAODnUKDglyDHFVCAjyd3YNDvb0c1fwdQ3x8HfhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkamBgaGJmbmjobGxKkCAO2cIac</recordid><startdate>20250102</startdate><enddate>20250102</enddate><creator>OH, Seung-Min</creator><creator>JUNG, In-Il</creator><creator>LEE, Jong-Seok</creator><scope>EVB</scope></search><sort><creationdate>20250102</creationdate><title>SUBSTRATE PROCESSING METHOD</title><author>OH, Seung-Min ; 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| subjects | BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING |
| title | SUBSTRATE PROCESSING METHOD |
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