ENCLOSURE SYSTEM SHELF
A shelf system includes a first distal portion configured to be fastened to a first surface of an enclosure system. The first distal portion includes a first carrier alignment feature and a first process kit ring alignment feature. The shelf system further includes a second distal portion configured...
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creator | Green, Aaron Menk, John C Bergantz, Nicholas Michael |
description | A shelf system includes a first distal portion configured to be fastened to a first surface of an enclosure system. The first distal portion includes a first carrier alignment feature and a first process kit ring alignment feature. The shelf system further includes a second distal portion configured to be fastened to a second surface of the enclosure system. The second distal portion includes a second carrier alignment feature and a second process kit ring alignment feature. The first carrier alignment feature and the second carrier alignment feature are configured to be disposed proximate outer surfaces of a carrier to align the carrier in the enclosure system. The first process kit ring alignment feature and the second process kit ring alignment feature are configured to be proximate inner surfaces of a process kit ring to align the process kit ring on the carrier in the enclosure system. |
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The first distal portion includes a first carrier alignment feature and a first process kit ring alignment feature. The shelf system further includes a second distal portion configured to be fastened to a second surface of the enclosure system. The second distal portion includes a second carrier alignment feature and a second process kit ring alignment feature. The first carrier alignment feature and the second carrier alignment feature are configured to be disposed proximate outer surfaces of a carrier to align the carrier in the enclosure system. The first process kit ring alignment feature and the second process kit ring alignment feature are configured to be proximate inner surfaces of a process kit ring to align the process kit ring on the carrier in the enclosure system.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241226&DB=EPODOC&CC=US&NR=2024429079A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241226&DB=EPODOC&CC=US&NR=2024429079A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Green, Aaron</creatorcontrib><creatorcontrib>Menk, John C</creatorcontrib><creatorcontrib>Bergantz, Nicholas Michael</creatorcontrib><title>ENCLOSURE SYSTEM SHELF</title><description>A shelf system includes a first distal portion configured to be fastened to a first surface of an enclosure system. The first distal portion includes a first carrier alignment feature and a first process kit ring alignment feature. The shelf system further includes a second distal portion configured to be fastened to a second surface of the enclosure system. The second distal portion includes a second carrier alignment feature and a second process kit ring alignment feature. The first carrier alignment feature and the second carrier alignment feature are configured to be disposed proximate outer surfaces of a carrier to align the carrier in the enclosure system. The first process kit ring alignment feature and the second process kit ring alignment feature are configured to be proximate inner surfaces of a process kit ring to align the process kit ring on the carrier in the enclosure system.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBz9XP28Q8ODXJVCI4MDnH1VQj2cPVx42FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGJiZGlgbmlo6GxsSpAgBCgCBG</recordid><startdate>20241226</startdate><enddate>20241226</enddate><creator>Green, Aaron</creator><creator>Menk, John C</creator><creator>Bergantz, Nicholas Michael</creator><scope>EVB</scope></search><sort><creationdate>20241226</creationdate><title>ENCLOSURE SYSTEM SHELF</title><author>Green, Aaron ; Menk, John C ; Bergantz, Nicholas Michael</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024429079A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Green, Aaron</creatorcontrib><creatorcontrib>Menk, John C</creatorcontrib><creatorcontrib>Bergantz, Nicholas Michael</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Green, Aaron</au><au>Menk, John C</au><au>Bergantz, Nicholas Michael</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ENCLOSURE SYSTEM SHELF</title><date>2024-12-26</date><risdate>2024</risdate><abstract>A shelf system includes a first distal portion configured to be fastened to a first surface of an enclosure system. The first distal portion includes a first carrier alignment feature and a first process kit ring alignment feature. The shelf system further includes a second distal portion configured to be fastened to a second surface of the enclosure system. The second distal portion includes a second carrier alignment feature and a second process kit ring alignment feature. The first carrier alignment feature and the second carrier alignment feature are configured to be disposed proximate outer surfaces of a carrier to align the carrier in the enclosure system. The first process kit ring alignment feature and the second process kit ring alignment feature are configured to be proximate inner surfaces of a process kit ring to align the process kit ring on the carrier in the enclosure system.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | ENCLOSURE SYSTEM SHELF |
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