RELIABLE SEMICONDUCTOR PACKAGES

A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die region with a die attached thereto. An encapsulant is disposed to cover encapsulation region of the package substrate. A protective cover is disposed over the die and attached...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PUNZALAN, Jeffrey, SHIM, IL Kwon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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