METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

A manufacturing method of a semiconductor device includes the steps of supplying a paste-like bonding material on a base material, pressing down the bonding material with an object to be bonded, and bonding the object to be bonded onto the base material by the bonding material. The object to be bond...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SAKAI, Norikazu
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A manufacturing method of a semiconductor device includes the steps of supplying a paste-like bonding material on a base material, pressing down the bonding material with an object to be bonded, and bonding the object to be bonded onto the base material by the bonding material. The object to be bonded is rectangular. The bonding material supplied onto the base material includes a central portion located at a center of the object to be bonded, an extended portion extending from the central portion toward each vertex of the object to be bonded, and a retreated portion that is retreated from each side of the object to be bonded. A distance of 40 μm or more is secured from an upper surface of the object to be bonded to an upper end of the bonding material that has crept up along a side surface of the object to be bonded.