METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUSING FOR A SEMICONDUCTOR MODULE

A method includes applying a first material to a first surface, the first material including a matrix material and an adhesion promoter. The matrix material is configured to cure when heated to a defined temperature for a defined period of time. The adhesion promoter is configured to be activated wh...

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Bibliographische Detailangaben
Hauptverfasser: Jäger, Fabian, Troska, Georg, Wiesemann, Markus, Herzer, Anita
Format: Patent
Sprache:eng
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