METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUSING FOR A SEMICONDUCTOR MODULE

METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUSING FOR A SEMICONDUCTOR MODULE

A method includes applying a first material to a first surface, the first material including a matrix material and an adhesion promoter. The matrix material is configured to cure when heated to a defined temperature for a defined period of time. The adhesion promoter is configured to be activated wh...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Jäger, Fabian, Troska, Georg, Wiesemann, Markus, Herzer, Anita
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Jäger, Fabian
Troska, Georg
Wiesemann, Markus
Herzer, Anita
description A method includes applying a first material to a first surface, the first material including a matrix material and an adhesion promoter. The matrix material is configured to cure when heated to a defined temperature for a defined period of time. The adhesion promoter is configured to be activated when heated to a temperature that is higher than the defined temperature and/or for a period of time that is longer than the defined period of time. The method further includes heating the first material to the defined temperature for the defined period of time such that the matrix material cures and the adhesion promoter remains inactive, thereby forming a pre-seal.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024413025A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024413025A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024413025A13</originalsourceid><addsrcrecordid>eNrjZEj0dQ3x8HcJVnDzD1IICPJ3CXX29HNXcFQIdnX0AQuCmL6ezv5-QKkQIN8XqMbHVUfB0c8FKOfhHxoM0oBbJQ8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstiQ8NNjIwMjExNDYwMnU0NCZOFQAzmzQN</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUSING FOR A SEMICONDUCTOR MODULE</title><source>esp@cenet</source><creator>Jäger, Fabian ; Troska, Georg ; Wiesemann, Markus ; Herzer, Anita</creator><creatorcontrib>Jäger, Fabian ; Troska, Georg ; Wiesemann, Markus ; Herzer, Anita</creatorcontrib><description>A method includes applying a first material to a first surface, the first material including a matrix material and an adhesion promoter. The matrix material is configured to cure when heated to a defined temperature for a defined period of time. The adhesion promoter is configured to be activated when heated to a temperature that is higher than the defined temperature and/or for a period of time that is longer than the defined period of time. The method further includes heating the first material to the defined temperature for the defined period of time such that the matrix material cures and the adhesion promoter remains inactive, thereby forming a pre-seal.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241212&amp;DB=EPODOC&amp;CC=US&amp;NR=2024413025A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241212&amp;DB=EPODOC&amp;CC=US&amp;NR=2024413025A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Jäger, Fabian</creatorcontrib><creatorcontrib>Troska, Georg</creatorcontrib><creatorcontrib>Wiesemann, Markus</creatorcontrib><creatorcontrib>Herzer, Anita</creatorcontrib><title>METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUSING FOR A SEMICONDUCTOR MODULE</title><description>A method includes applying a first material to a first surface, the first material including a matrix material and an adhesion promoter. The matrix material is configured to cure when heated to a defined temperature for a defined period of time. The adhesion promoter is configured to be activated when heated to a temperature that is higher than the defined temperature and/or for a period of time that is longer than the defined period of time. The method further includes heating the first material to the defined temperature for the defined period of time such that the matrix material cures and the adhesion promoter remains inactive, thereby forming a pre-seal.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEj0dQ3x8HcJVnDzD1IICPJ3CXX29HNXcFQIdnX0AQuCmL6ezv5-QKkQIN8XqMbHVUfB0c8FKOfhHxoM0oBbJQ8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstiQ8NNjIwMjExNDYwMnU0NCZOFQAzmzQN</recordid><startdate>20241212</startdate><enddate>20241212</enddate><creator>Jäger, Fabian</creator><creator>Troska, Georg</creator><creator>Wiesemann, Markus</creator><creator>Herzer, Anita</creator><scope>EVB</scope></search><sort><creationdate>20241212</creationdate><title>METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUSING FOR A SEMICONDUCTOR MODULE</title><author>Jäger, Fabian ; Troska, Georg ; Wiesemann, Markus ; Herzer, Anita</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024413025A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Jäger, Fabian</creatorcontrib><creatorcontrib>Troska, Georg</creatorcontrib><creatorcontrib>Wiesemann, Markus</creatorcontrib><creatorcontrib>Herzer, Anita</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jäger, Fabian</au><au>Troska, Georg</au><au>Wiesemann, Markus</au><au>Herzer, Anita</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUSING FOR A SEMICONDUCTOR MODULE</title><date>2024-12-12</date><risdate>2024</risdate><abstract>A method includes applying a first material to a first surface, the first material including a matrix material and an adhesion promoter. The matrix material is configured to cure when heated to a defined temperature for a defined period of time. The adhesion promoter is configured to be activated when heated to a temperature that is higher than the defined temperature and/or for a period of time that is longer than the defined period of time. The method further includes heating the first material to the defined temperature for the defined period of time such that the matrix material cures and the adhesion promoter remains inactive, thereby forming a pre-seal.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2024413025A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUSING FOR A SEMICONDUCTOR MODULE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T05%3A06%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=J%C3%A4ger,%20Fabian&rft.date=2024-12-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024413025A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true