Methods of Filling Openings with Conductive Material, and Assemblies Having Vertically-Stacked Conductive Structures

Some embodiments include a method in which an assembly is formed to have voids within a stack, and to have slits adjacent the voids. Peripheral boundaries of the voids have proximal regions near the slits and distal regions adjacent the proximal regions. A material is deposited within the voids unde...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Greenlee, Jordan D, McTeer, Everett A, Meldrim, John Mark
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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