MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

A molding composition for a semiconductor package includes fillers, a resin, a hardener and a stress relaxation agent. The fillers are contained in an amount of 80% by weight to 90% by weight based on a total weight of the molding composition. The resin is contained in an amount of 1% by weight to 1...

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Hauptverfasser:	Liao, Sih-Hao, Hsiao, Meng-Hsuan, Yeh, Ming-Shih, Lee, Chia Hao
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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