PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTIONS OF FIBERS TO ON-CHIP OPTICAL COMPONENTS

A photonic integrated circuit (PIC) die are provided. The PIC die includes a set of optical connect grooves including a first groove aligning a core of a first optical fiber positioned with a first optical component in a first layer at a first vertical depth in a plurality of layers of a body of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Polomoff, Nicholas A, Bian, Yusheng, Houghton, Thomas
Format:	Patent
Sprache:	eng
Schlagworte:	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS
Online-Zugang:	Volltext bestellen
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