SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME

Embodiments of a substrate processing apparatus and substrate processing method are provided. Embodiments include a laser that directs a laser beam toward a substrate. Embodiments further include a chuck spaced apart in a first direction from the laser. Embodiments include a lower particle blocker d...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hong, Seongpyo, Lee, Sang Min, Koo, Namil, Bae, Sangwoo
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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