PROCESSING APPARATUS, PROCESSING METHOD, AND MANUFACTURING METHOD OF SUBSTRATE

The present disclosure provides a processing apparatus that forms protrusions and recesses on a substrate surface by ablation processing using a laser beam.

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Bibliographische Detailangaben
Hauptverfasser:	Ohtani, Yoshikazu, Yamaoka, Hiroshi, Kurata, Masami, Usami, Taketo
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present disclosure provides a processing apparatus that forms protrusions and recesses on a substrate surface by ablation processing using a laser beam.