ELASTOMER EMBEDDED MULTIPOINT CONTACT COOLING

Example implementations relate to a cooling assembly of a host circuit device, a circuit assembly including the host circuit device and a removable circuit device, and a method for thermal management of the removable circuit device removably connected to the host circuit device. The cooling assembly...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lunsman, Harvey J, Dean, Steven
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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