FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
A film-shaped adhesive having a first adhesive region and a second adhesive region along a thickness direction, in which the first adhesive region has photocurability and thermosetting properties, and the second adhesive region has thermosetting properties but does not have photocurability.
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| creator | OHKUBO, Keisuke KIMURA, Ryosuke ISHIGE, Hiroyuki SATO, Makoto |
| description | A film-shaped adhesive having a first adhesive region and a second adhesive region along a thickness direction, in which the first adhesive region has photocurability and thermosetting properties, and the second adhesive region has thermosetting properties but does not have photocurability. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024395759A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024395759A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024395759A13</originalsourceid><addsrcrecordid>eNrjZNjq5unjq-vj6e2q4Oji4RrsGeaq4OYfpBDs6uvp7O_nEuoc4h8UrKPg6xri4e8ClgoI8gcKe_q5KxCpFy4Z4hjgisMoFD0KLq5hns5ApY5-LlhleBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGRibGlqbmppaOhMXGqAHFGS54</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>OHKUBO, Keisuke ; KIMURA, Ryosuke ; ISHIGE, Hiroyuki ; SATO, Makoto</creator><creatorcontrib>OHKUBO, Keisuke ; KIMURA, Ryosuke ; ISHIGE, Hiroyuki ; SATO, Makoto</creatorcontrib><description>A film-shaped adhesive having a first adhesive region and a second adhesive region along a thickness direction, in which the first adhesive region has photocurability and thermosetting properties, and the second adhesive region has thermosetting properties but does not have photocurability.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241128&DB=EPODOC&CC=US&NR=2024395759A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241128&DB=EPODOC&CC=US&NR=2024395759A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OHKUBO, Keisuke</creatorcontrib><creatorcontrib>KIMURA, Ryosuke</creatorcontrib><creatorcontrib>ISHIGE, Hiroyuki</creatorcontrib><creatorcontrib>SATO, Makoto</creatorcontrib><title>FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE</title><description>A film-shaped adhesive having a first adhesive region and a second adhesive region along a thickness direction, in which the first adhesive region has photocurability and thermosetting properties, and the second adhesive region has thermosetting properties but does not have photocurability.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNjq5unjq-vj6e2q4Oji4RrsGeaq4OYfpBDs6uvp7O_nEuoc4h8UrKPg6xri4e8ClgoI8gcKe_q5KxCpFy4Z4hjgisMoFD0KLq5hns5ApY5-LlhleBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGRibGlqbmppaOhMXGqAHFGS54</recordid><startdate>20241128</startdate><enddate>20241128</enddate><creator>OHKUBO, Keisuke</creator><creator>KIMURA, Ryosuke</creator><creator>ISHIGE, Hiroyuki</creator><creator>SATO, Makoto</creator><scope>EVB</scope></search><sort><creationdate>20241128</creationdate><title>FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE</title><author>OHKUBO, Keisuke ; KIMURA, Ryosuke ; ISHIGE, Hiroyuki ; SATO, Makoto</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024395759A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>OHKUBO, Keisuke</creatorcontrib><creatorcontrib>KIMURA, Ryosuke</creatorcontrib><creatorcontrib>ISHIGE, Hiroyuki</creatorcontrib><creatorcontrib>SATO, Makoto</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OHKUBO, Keisuke</au><au>KIMURA, Ryosuke</au><au>ISHIGE, Hiroyuki</au><au>SATO, Makoto</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE</title><date>2024-11-28</date><risdate>2024</risdate><abstract>A film-shaped adhesive having a first adhesive region and a second adhesive region along a thickness direction, in which the first adhesive region has photocurability and thermosetting properties, and the second adhesive region has thermosetting properties but does not have photocurability.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE |
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