CIRCUIT MODULE

In a circuit module of the present disclosure, one or more solder balls have an ellipsoidal shape, are located in an inter-board region between an upper circuit board and a lower circuit board, and electrically connect the upper circuit board and the lower circuit board. The size of the second solde...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOSHIMORI, Hiroki, NAKAGOSHI, Hideo, TAKAKURA, Tsuyoshi, OTSUBO, Yoshihito
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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