PACKAGE WITH EMBEDDED TRACES

PACKAGE WITH EMBEDDED TRACES

A package with embedded traces has a main body and multiple leads. The main body includes an insulating body, a die in the insulating body, and multiple conductive traces in the insulating body, wherein the die is electrically connected to the insulating body. The multiple leads extend outward from...

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Hauptverfasser: WU, JENG-SIAN, WANG, YUNG-HUI, HO, CHUNG-HSIUNG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator WU, JENG-SIAN
WANG, YUNG-HUI
HO, CHUNG-HSIUNG
description A package with embedded traces has a main body and multiple leads. The main body includes an insulating body, a die in the insulating body, and multiple conductive traces in the insulating body, wherein the die is electrically connected to the insulating body. The multiple leads extend outward from the main body. Each of the multiple leads includes a lead carrier and two conducting layers that are formed on opposite surfaces of the lead carrier and electrically connected to the respective conductive trace so that the two conducting layers are electrically connected to the die, wherein at least one of the two conducting layers is embedded in the lead carrier.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title PACKAGE WITH EMBEDDED TRACES
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