SEMICONDUCTOR MANUFACTURING APPARATUS
Provided is a semiconductor manufacturing apparatus that is capable of, while holding one surface of the wafer, grinding the holding surface of a wafer. A semiconductor manufacturing apparatus includes a first main surface holding unit that comes into contact with a center portion of a first main su...
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| creator | YAMAMOTO, Shigehisa AKAO, Shinya KIMURA, Yasuhiro OKI, Hirofumi |
| description | Provided is a semiconductor manufacturing apparatus that is capable of, while holding one surface of the wafer, grinding the holding surface of a wafer. A semiconductor manufacturing apparatus includes a first main surface holding unit that comes into contact with a center portion of a first main surface of a wafer in plan view and holds the wafer, and a first grinding unit that rotates about a rotation axis that overlaps a center of the wafer in plan view and extends in a direction perpendicular to the first main surface, and that grinds an outer periphery that is a region surrounding the center portion of the first main surface in contact with the outer periphery of the first main surface. |
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A semiconductor manufacturing apparatus includes a first main surface holding unit that comes into contact with a center portion of a first main surface of a wafer in plan view and holds the wafer, and a first grinding unit that rotates about a rotation axis that overlaps a center of the wafer in plan view and extends in a direction perpendicular to the first main surface, and that grinds an outer periphery that is a region surrounding the center portion of the first main surface in contact with the outer periphery of the first main surface.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241121&DB=EPODOC&CC=US&NR=2024387201A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241121&DB=EPODOC&CC=US&NR=2024387201A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAMOTO, Shigehisa</creatorcontrib><creatorcontrib>AKAO, Shinya</creatorcontrib><creatorcontrib>KIMURA, Yasuhiro</creatorcontrib><creatorcontrib>OKI, Hirofumi</creatorcontrib><title>SEMICONDUCTOR MANUFACTURING APPARATUS</title><description>Provided is a semiconductor manufacturing apparatus that is capable of, while holding one surface of the wafer, grinding the holding surface of a wafer. 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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | SEMICONDUCTOR MANUFACTURING APPARATUS |
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