METHOD FOR DRYING WAFER

A method for drying a wafer includes a cleaning step, a liquid replacing step, and a drying step. In the cleaning step, a workpiece located in a process chamber is cleaned with a cleaning solution. In the liquid replacing step, a drying agent in gas phase is compressed to convert into liquid phase,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIN, SHIH-KAI, CHOU, SHENG-YAO, KUO, HUNG-MING, SUN, PEI-JUN, WANG, YU-BO, CHANG, TINGANG, KUO, CHUAN-WEI
Format: Patent
Sprache:eng
Schlagworte:
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