METALIZING MATERIALS

METALIZING MATERIALS

Metalized materials are provided, in which the metalized materials include (i) a substrate comprising a nonwoven, a film, or a combination thereof; (ii) a metal coating layer (MCL); and (iii) a transparent coating layer (TCL); wherein the MCL is located directly or indirectly between the substrate a...

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Hauptverfasser: Wu, Dong, Fang, Minglan, Jin, Yongji
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Sprache:eng
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LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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creator Wu, Dong
Fang, Minglan
Jin, Yongji
description Metalized materials are provided, in which the metalized materials include (i) a substrate comprising a nonwoven, a film, or a combination thereof; (ii) a metal coating layer (MCL); and (iii) a transparent coating layer (TCL); wherein the MCL is located directly or indirectly between the substrate and the TCL. Peelable metalized materials are also provided, in which the peelable metalized materials include a metalized material and a removable carrier layer located directly adjacent to the TCL. Methods for making peelable metalized materials and metalized materials are also provided.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024383230A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024383230A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024383230A13</originalsourceid><addsrcrecordid>eNrjZBDxdQ1x9PGM8vRzV_B1DHEN8nT0CeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRibGFsZGxgaOhsbEqQIA_fgfmw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METALIZING MATERIALS</title><source>esp@cenet</source><creator>Wu, Dong ; Fang, Minglan ; Jin, Yongji</creator><creatorcontrib>Wu, Dong ; Fang, Minglan ; Jin, Yongji</creatorcontrib><description>Metalized materials are provided, in which the metalized materials include (i) a substrate comprising a nonwoven, a film, or a combination thereof; (ii) a metal coating layer (MCL); and (iii) a transparent coating layer (TCL); wherein the MCL is located directly or indirectly between the substrate and the TCL. Peelable metalized materials are also provided, in which the peelable metalized materials include a metalized material and a removable carrier layer located directly adjacent to the TCL. Methods for making peelable metalized materials and metalized materials are also provided.</description><language>eng</language><subject>LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241121&amp;DB=EPODOC&amp;CC=US&amp;NR=2024383230A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241121&amp;DB=EPODOC&amp;CC=US&amp;NR=2024383230A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Wu, Dong</creatorcontrib><creatorcontrib>Fang, Minglan</creatorcontrib><creatorcontrib>Jin, Yongji</creatorcontrib><title>METALIZING MATERIALS</title><description>Metalized materials are provided, in which the metalized materials include (i) a substrate comprising a nonwoven, a film, or a combination thereof; (ii) a metal coating layer (MCL); and (iii) a transparent coating layer (TCL); wherein the MCL is located directly or indirectly between the substrate and the TCL. Peelable metalized materials are also provided, in which the peelable metalized materials include a metalized material and a removable carrier layer located directly adjacent to the TCL. Methods for making peelable metalized materials and metalized materials are also provided.</description><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDxdQ1x9PGM8vRzV_B1DHEN8nT0CeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRibGFsZGxgaOhsbEqQIA_fgfmw</recordid><startdate>20241121</startdate><enddate>20241121</enddate><creator>Wu, Dong</creator><creator>Fang, Minglan</creator><creator>Jin, Yongji</creator><scope>EVB</scope></search><sort><creationdate>20241121</creationdate><title>METALIZING MATERIALS</title><author>Wu, Dong ; Fang, Minglan ; Jin, Yongji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024383230A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Wu, Dong</creatorcontrib><creatorcontrib>Fang, Minglan</creatorcontrib><creatorcontrib>Jin, Yongji</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wu, Dong</au><au>Fang, Minglan</au><au>Jin, Yongji</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METALIZING MATERIALS</title><date>2024-11-21</date><risdate>2024</risdate><abstract>Metalized materials are provided, in which the metalized materials include (i) a substrate comprising a nonwoven, a film, or a combination thereof; (ii) a metal coating layer (MCL); and (iii) a transparent coating layer (TCL); wherein the MCL is located directly or indirectly between the substrate and the TCL. Peelable metalized materials are also provided, in which the peelable metalized materials include a metalized material and a removable carrier layer located directly adjacent to the TCL. Methods for making peelable metalized materials and metalized materials are also provided.</abstract><oa>free_for_read</oa></addata></record>
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subjects LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
title METALIZING MATERIALS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T07%3A45%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Wu,%20Dong&rft.date=2024-11-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024383230A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true